| 新型无铅焊料的研制 |
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| 引用本文： | 潘建军,于新泉,龙伟民,乔培新.新型无铅焊料的研制[J].电子工艺技术,2007,28(3):139-141. |
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| 作者姓名： | 潘建军 于新泉 龙伟民 乔培新 |
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| 作者单位： | 1. 郑州机械研究所,河南,郑州,450052
2. 武汉材料保护研究所,湖北,武汉,430030 |
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| 摘 要： | 由于目前使用的Sn3.5AgCu无铅焊料,温度较高、润湿性较差.在Sn3.5AgCu无铅钎料中添加金属元素Ga、Bi,并改变Ag的含量,对其合金进行熔化温度、润湿性、力学性能和微观组织研究.研究表明,添加Ga、Bi并改变Ag含量有利于降低Sn3.5AgCu合金的熔化温度和改善其润湿性,并提高了力学性能.
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| 关 键 词： | 无铅钎料 Ga、Bi 润湿性 |
| 文章编号： | 1001-3474（2007）03-0139-03 |
| 修稿时间： | 2007-03-19 |
Development of New Lead - free Solder |
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| PAN Jian-jun,YU Xin-quan,LONG Wei-min,QIAO Pei-xin.Development of New Lead - free Solder[J].Electronics Process Technology,2007,28(3):139-141. |
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| Authors: | PAN Jian-jun YU Xin-quan LONG Wei-min QIAO Pei-xin |
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| Affiliation: | 1. Zhengzhou Research Institute of Mechanical Engineering, Zhengzhou 450052, China ; 2. Wuhan Research Institute of Material Protection, Wuhan 430030, China |
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| Abstract: | Because Sn3.5AgCu lead -free solder used at present has the high melting point and bad wetting property,we add metallic element Ga, Bi to Sn3.5AgCu lead -free solder, and change Ag content and study their melting temperatures, wetting property, mechanical property and microstructure. Result indicates that adding Ga,Bi and change Ag content can reduce the Sn3.5AgCu melting temperature, improve its wetting property and mechanical property. |
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| Keywords: | Lead - free solder Ga Bi Wetting property |
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