| 不同添加剂镀铜效果的研究 |
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| 引用本文： | 王科成.不同添加剂镀铜效果的研究[J].印制电路信息,2012(10):44-46. |
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| 作者姓名： | 王科成 |
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| 作者单位： | 博敏电子股份有限公司 |
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| 摘 要： | 对两种不同添加剂镀液在通孔和盲孔电镀过程深镀能力的研究,说明其各自对于通孔和盲孔电镀的优势所在。并确定对于通孔和盲孔同步电镀镀液添加剂的选择。
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| 关 键 词： | 添加剂 通孔 盲孔 深镀能力 |
Research on the effect of copper plating by different additives |
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| WANG Ke-cheng.Research on the effect of copper plating by different additives[J].Printed Circuit Information,2012(10):44-46. |
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| Authors: | WANG Ke-cheng |
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| Affiliation: | WANG Ke-cheng |
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| Abstract: | In this paper,the two different bath additives deep plating abilities for the PTH hole and blind hole electroplating process were studied with the different advantages.It also concluded the choices for the PTH hole and blind hole synchronous electroplating bath additives choice. |
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| Keywords: | additive PTH hole blind hole deep plating capability |
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