| SnAgCuRE系钎料的钎焊接头组织与力学性能 |
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| 引用本文： | 韩运侠,张柯柯. SnAgCuRE系钎料的钎焊接头组织与力学性能[J]. 电子元件与材料, 2007, 26(10): 74-76 |
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| 作者姓名： | 韩运侠 张柯柯 |
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| 作者单位： | 洛阳师范学院,物理与电子信息学院,河南,洛阳,471022;河南科技大学,材料科学与工程学院,河南,洛阳,471003 |
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| 基金项目： | 河南省高效创新人才基金 |
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| 摘 要： | 以Sn2.5Ag0.7Cu为基础,添加微量的稀土(RE)r(Ce︰La)为4︰1,研究了钎焊接头的显微组织与力学性能。结果表明:添加微量的RE后,钎料与Cu试样间的界面层厚度明显减小,且界面处的组织更加平滑,相应地其剪切强度随微量RE的添加而增大,并在RE含量(质量分数)为0.1%时达到最大值36MPa。
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| 关 键 词： | 金属材料 无铅钎料 显微组织 力学性能 |
| 文章编号： | 1001-2028（2007）10-0074-03 |
| 修稿时间： | 2007-06-11 |
Microstructure and mechanic properties of soldering joints for SnAgCuRE solder alloys |
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| HAN Yun-xia,ZHANG Ke-ke. Microstructure and mechanic properties of soldering joints for SnAgCuRE solder alloys[J]. Electronic Components & Materials, 2007, 26(10): 74-76 |
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| Authors: | HAN Yun-xia ZHANG Ke-ke |
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| Affiliation: | 1. College of Physics and Electronic Information, Luoyang Normal College, Luoyang 471022, Henan Province, China; 2. Materials Science and Engineering College, Henan University of Science and Technology, Luoyang 471003, Henan Province, China |
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| Abstract: | The Sn2.5Ag0.7Cu solder alloy was selected out by comprehensive comparison. Minute amount of RE r (Ce:La=4:1) was added into Sn2.5Ag0.7Cu solder,the effects of different amount of RE on microstructure and mechanical properties of the alloy were analyzed. The results indicate that its interfacial ply will be decrease and microstructure will be smoothness if the RE is added. The shear-resistant strength will be improved along with the increasing of the content of RE,it maximal value is 36 MPa when the content of RE is about 0.1%. |
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| Keywords: | melallic material lead-free solder microstructure mechanic properties |
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