An electrostatic clamp with temperature stabilization of semiconductor wafers under plasma treatment

An electrostatic clamp (ESC) with helium supply under a wafer allows the temperature of semiconductor wafers to be stabilized during vacuum-plasma treatment (10⁻⁴–10 Pa), when there is an intensive heat flow from the plasma toward the wafer. Heat is efficiently removed from the plate toward the ESC due to the volume heat transmission through the helium supplied into a gap between the wafer and the ESC.