| 可焊性光亮锡铋合金电镀工艺研究 |
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| 引用本文： | 吴华强,倪进治.可焊性光亮锡铋合金电镀工艺研究[J].表面技术,1998,27(2):7-8. |
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| 作者姓名： | 吴华强 倪进治 |
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| 作者单位： | 安徽师范大学化学系 241000
(吴华强)，安徽师范大学化学系 92级学生241000(倪进治) |
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| 摘 要： | 研究一种可焊性光亮锡铋合金电镀工艺的镀液配方和电镀操作条件；测试了镀液的分散能力、深镀能力、阴极电流效率和沉积速度；经小槽电镀，获得外观致密均匀、似镜面光亮、结合力强、具有优良的可焊性镀层。
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| 关 键 词： | 可焊性 锡铋合金 电镀 镀合金 工艺 |
Study on the electroplating technology of solderable bright Sn-Bi alloy |
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| Wu Huaqiang et al.Study on the electroplating technology of solderable bright Sn-Bi alloy[J].Surface Technology,1998,27(2):7-8. |
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| Authors: | Wu Huaqiang |
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| Affiliation: | Wu Huaqiang et al |
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| Abstract: | The bath components and the operating conditions for a new electroplating technology of solderable bright Sn-Bi alloy were studied. The covering power and throwing power as well as cathodic current efficiency and depositing velocity of the bath were determined. A uniform ,compact ,bright and excellent solderable coating with good adhesion was obtained by the experimental electroplating. |
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| Keywords: | Solderable Sn-Bi alloy Electroplating |
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