Support vector machine-based inspection of solder joints using circular illumination |
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| Authors: | Yun T.S. Sim K.J. Kim H.J. |
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| Affiliation: | Dept. of Comput. Eng., Kyungpook Nat. Univ., Taegu, South Korea; |
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| Abstract: | ![]()
A method for inspecting solder joints using support vector machines (SVMs) and a tiered circular illumination technique is proposed. The illumination technique provides visual information that allows the 3D shape of the solder joint surface to be determined. The extracted features are used to classify the solder joint using an SVM classifier. Experimental results show the effectiveness of the proposed method. |
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