| Sn－Zn－In软钎料合金初步研究 |
| |
| 引用本文： | 马鑫,方洪渊,董秀丽,钱乙余,丁克俭. Sn－Zn－In软钎料合金初步研究[J]. 电子工艺技术, 1996, 0(5) |
| |
| 作者姓名： | 马鑫 方洪渊 董秀丽 钱乙余 丁克俭 |
| |
| 作者单位： | 哈尔滨工业大学焊接教研室，无锡群力有色金属材料厂 |
| |
| 摘 要： | 对Ｓｎ－Ｚｎ－Ｉｎ钎料合金的性能进行了研究，钎料铺展性和剪切强度试验结果表明，在Ｓｎ－９Ｚｎ－Ｉｎ软钎料合金中，随Ｉｎ含量增加，铺展面积增大，钎焊接头剪切强度降低。钎料熔点和接头组织等性能的综合分析结果表明Ｓｎ－９Ｚｎ－１０Ｉｎ的性能已接近或超过传统的Ｓｎ－Ｐｂ共晶
|
| 关 键 词： | 锡锌铟合金 无铅钎料 软钎焊 |
The study of Sn-Zn-In solder alloys |
| |
| Ma Xin Fang Hongyuan Ding Kejian. The study of Sn-Zn-In solder alloys[J]. Electronics Process Technology, 1996, 0(5) |
| |
| Authors: | Ma Xin Fang Hongyuan Ding Kejian |
| |
| Affiliation: | Ma Xin Fang Hongyuan Ding Kejian |
| |
| Abstract: | The properites of Sn-Zn-In solder,have been studied in this paper.By solder spreading and shear strength test,it showes that in Sn-9Zn-In solder solder spreading area increases with the increase of in content,but shear strength of solder joints decrease.Considering the test results and the melting point of solder,the properties of Sn-9Zn-In solder close to or exced that of Sn-Pb eutectic solder. |
| |
| Keywords: | Sn-Zn-In alloy Lead-free solder Soldering |
| 本文献已被 CNKI 等数据库收录！ |
