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IC引线框架材料概述
引用本文:刘凯,齐亮,谢春晓.IC引线框架材料概述[J].热处理,2006,21(2):21-24.
作者姓名:刘凯  齐亮  谢春晓
作者单位:江西理工大学,江西,赣州,341000
摘    要:评述了国内外引线框架材料研究开发的现状,指出了国内引线框架用铜带与国外产品相比存在的差距,分析了今后引线框架铜带的需求和发展方向,并介绍了几种典型的合金及其特性。

关 键 词:引线框架材料  铜基合金  Cu-Fe-P合金  Cu-Cr-Zr合金
文章编号:1008-1690(2006)02-0021-004
收稿时间:2005-10-25
修稿时间:2005年10月25

Summarization on the Materials for IC Lead Frame
LIU Kai,QI Liang,XIE Chun-xiao.Summarization on the Materials for IC Lead Frame[J].Heat Treatment,2006,21(2):21-24.
Authors:LIU Kai  QI Liang  XIE Chun-xiao
Affiliation:School of Materials Science and Enginnering, Jiangxi University of Science and Technology, Ganzhou Jiangxi 341000
Abstract:The current status of development of the lead frame materials at home and abroad was summarized. The gap between Chinese-made strips and foreign copper ones for the lead frame was pointed out. The requirements for copper strips for the lead frame and its development were analyzed. Moreover,several kinds of typical alloys and their characteristics were introduced.
Keywords:material for lead frame  copper alloy  Cu-Fe-P alloy  Cu-Cr-Zr alloy
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