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| 电子电镀技术的回顾与展望 | |
| 引用本文： | 夏传义.电子电镀技术的回顾与展望[J].微纳电子技术,1996(3). |
| 作者姓名： | 夏传义 |
| 作者单位： | 石家庄电子部第１３研究所 |
| 摘 要： | 评述了国内外电子工业中贵金属及其合金镀层、可焊性镀层、化学镀及功能镀等有关方面近期发展及应用情况，并展望了９０年代电子电镀技术的发展动向。 |
| 关 键 词： | 电子电镀，贵金属及其合金镀，可焊性镀层，化学镀，功能镀 |
Retrospects and Prospects of Plating in the Electronics Industry |
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| Xia Chuanyi.Retrospects and Prospects of Plating in the Electronics Industry[J].Micronanoelectronic Technology,1996(3). | |
| Authors: | Xia Chuanyi |
| Abstract: | The recent development and application of precious metal and its alloy plating, solderability coatings, electroless plating, and fuctional plating in the electronics industry in 1990' are forecasted. |
| Keywords: | Plating in the electronics industry Precious metal and its alloy plating Solderability coating Electroless plating Fuctional plating |
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