| 表面响应法在埋置型大功率多芯片微波组件热布局中的应用研究 |
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| 引用本文： | 陈品,吴兆华,黄红艳,张生,毕唐文,赵强. 表面响应法在埋置型大功率多芯片微波组件热布局中的应用研究[J]. 电子质量, 2011, 0(1): 40-43 |
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| 作者姓名： | 陈品 吴兆华 黄红艳 张生 毕唐文 赵强 |
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| 作者单位： | 桂林电子科技大学机电工程学院; |
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| 基金项目： | 广西研究生教育创新计划资助项目:三维微波多芯片组件的热-电磁特性分析(2010105950802M06) |
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| 摘 要： | 该文将有艰元模拟与基于统计试验的表面响应法(RSM)相结合,应用于特定需求的埋置型大功率多芯片微波组件热布局分析中,先通过ANSYS温度场分析,得出大功率芯片布局是影响整体温度和芯片结温的关键因素,再对一含有四个大功率芯片的微波组件模块进行了表面响应分析,得到了关于芯片坐标的线性回归方程,利用该方程可预测坐标组合下芯片...
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| 关 键 词： | 热分析 微渡組件 回归方程 表面响应法 热布局 |
Applications of Response Surface Methods in the Embedded High-Power Microwave Components Chip Placement |
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| Chen Pin,Wu Zhao-hua,Huang Hong-yan,Zhang Sheng,Bi Tang-wen,Zhao Qiang. Applications of Response Surface Methods in the Embedded High-Power Microwave Components Chip Placement[J]. Electronics Quality, 2011, 0(1): 40-43 |
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| Authors: | Chen Pin Wu Zhao-hua Huang Hong-yan Zhang Sheng Bi Tang-wen Zhao Qiang |
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| Affiliation: | Chen Pin,Wu Zhao-hua,Huang Hong-yan,Zhang Sheng,Bi Tang-wen,Zhao Qiang(school of Mechanical and Electrical Engineering,Guilin University of Electronic Technology,Guangxi Guilin 541004) |
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| Abstract: | In this paper,the analysis method of the combination of the finite element analogy and response surface method is applied to the analysis of thermal distribution for special use of embedded high-power chips microwave component.We can get the result that the placement of High-power chips is the key factor to the whole and the chip junction temperature through the temperature analysis by ANSYS.Then,the Microwave component module which concludes four High-power chips is analysed by the response surface method,... |
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| Keywords: | thermal analysis microwave components regression equation RSM thermal placement |
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