Investigate the influence of bonding temperature in transient liquid phase bonding of SiC and copper |
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Affiliation: | 1. School of Materials Science and Engineering, Tsinghua University, Beijing 100084, China;2. Department of Mechanical Engineering, Key Laboratory for Advanced Manufacturing by Materials Processing Technology, Tsinghua University, Beijing 100084, China;3. China Iron & Steel Research Institute Group, Beijing 100081, China;4. R&D Department, Yongtai Electric (Dong Guan) Co., Ltd, Dongguan 523000, China;5. College of Materials Science and Engineering, Shanxi Key Laboratory of Advanced Magnesium-based Materials, Taiyuan University of Technology, Taiyuan 030024, China |
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Abstract: | Joining of ceramics to metals provide timeless challenges in nuclear engineering industries. There is a pressing need for developing a suitable technique for joining silicon carbide (absorber) to copper radio frequency structures in Compact Linear Collider. Transient liquid phase bonding is a promising candidate that could be employed for joining of dissimilar materials with high re-melt temperature. In the present work, experiments were carried out on Transient Liquid phase bonding of silicon carbide and copper using metal interlayer. Lead, which has high wettability, is selected as an interlayer in the Transient Liquid Phase (TLP) bonding process. Experimental results of mechanical testing reveal the strength of the SiC/Cu joints and its integrity. Since, the bonding temperature is the most important parameter to achieve sound joint with good mechanical properties, its influence is studied through experimental trials. From the experimental studies, it is found that the bonding temperature should be 230 °C to obtain the good quality SiC/Copper joints.Favorable temperature distribution is achieved at this bonding temperature and consequently, the joining efficiency of SiC/Copper joints is increased.. |
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Keywords: | Dissimilar materials Transient Liquid Phase (TLP) Bonding Mechanical properties Scanning Electron microscopy Bonding temperature |
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