| 柔性磨体振动抛光机理探讨与对比 |
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| 引用本文： | 王纯,杨建明.柔性磨体振动抛光机理探讨与对比[J].中国机械工程,1997,8(3):107-109. |
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| 作者姓名： | 王纯 杨建明 |
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| 作者单位： | 淮海工学院!江苏省连云港市，222005，淮海工学院!江苏省连云港市，222005，中国船舶工业总公司第715!江苏省云港市，222005，上海冶金设计院!上海市，200002 |
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| 基金项目： | 江苏省应用基础研究基金 |
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| 摘 要： | 探讨新发明的柔性磨体振支抛光机理，介绍机床结构特点与应用范围，并从加工表面质量怀生产率等方面与超声波抛光、粘弹性磨料流加工等作分析比较。
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| 关 键 词： | 抛光 柔性磨体 机理 振动 抛光 |
Mechanism Research and Comparison on Vibrational Polishing With Flexible Grinder |
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| WangChun et al..Mechanism Research and Comparison on Vibrational Polishing With Flexible Grinder[J].China Mechanical Engineering,1997,8(3):107-109. |
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| Authors: | WangChun |
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| Abstract: | The polishing mechanism of a new developed vibrational polishing process with flexible grinder is explored, the structure characteristics of the machine tool and the application fields are introduced in the paper. The machinedsurface quality and productivity of the new process are compared with that of ultrasonic polishing and viscoelastic grain flow machining processes. |
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| Keywords: | polishing flexible grinder vibration mechani |
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