| 低温烧结型银基浆料烧结膜孔洞率的研究 |
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| 引用本文： | 甘卫平,张海旺,刘妍,张金玲.低温烧结型银基浆料烧结膜孔洞率的研究[J].电子元件与材料,2008,27(6):18-21. |
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| 作者姓名： | 甘卫平 张海旺 刘妍 张金玲 |
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| 作者单位： | 中南大学,材料科学与工程学院,湖南,长沙,410083 |
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| 摘 要： | 观察了低温烧结型银基浆料烧结膜的表面形貌,比较了有机载体含量对浆料烧结膜孔洞率的影响,分析了单一溶剂及混合溶剂有机载体所配浆料的TGA曲线。结果表明:采用混合溶剂可将浆料烧结膜的孔洞率从49.5%降低到21.6%。随着有机载体含量的增加,浆料烧结膜孔洞率增大。当w(有机载体)为21%时浆料可获得较佳的综合性能。
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| 关 键 词： | 电子技术 低温烧结型银基浆料 有机载体 孔洞率 |
| 文章编号： | 1001-2028(2008)06-0018-04 |
| 修稿时间： | 2008年2月27日 |
Investigation of void rate on sintered film of low temperature sintered Silver base paste |
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| GAN Wei-ping,ZHANG Hai-wang,LIU Yan,ZHANG Jing-ling.Investigation of void rate on sintered film of low temperature sintered Silver base paste[J].Electronic Components & Materials,2008,27(6):18-21. |
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| Authors: | GAN Wei-ping ZHANG Hai-wang LIU Yan ZHANG Jing-ling |
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| Affiliation: | GAN Wei-ping,ZHANG Hai-wang,LIU Yan,ZHANG Jing-ling(School of Materials Science , Engineering,Central South University,Changsha 410083,China) |
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| Abstract: | Surface morphology of sintered film of low temperature sintered silver base paste was observed.The influence of organic vehicle with different proportion on the void rate of sintered film was compared.The TGA curves of pastes prepared with single solvent and mixed solvent organic vehicles were analysed.Result shows that the application of mixed solvent can decreases the void rate from 49.5% to 21.6%.The void rate of the sinterd film increases along with the increasement of organic vihicle content,when w(org... |
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| Keywords: | electron technology low-temperature sintered silver base paste organic vehicle void rate |
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