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A four-point-bending-test for the stability assessment of glass frit bonded molded microsensors
Authors:K Nötzold  J Graf  R Müller-Fiedler
Affiliation:1. IMEC, Kapeldreef 75, Leuven B-3001, Belgium;2. University of Twente, Postbus 217, Enschede, 7500 AE, Netherlands;3. FB 2.047, NXP Semiconductors, Gerstweg 2, Nijmegen, 6534 AE, Netherlands;1. Institute of Information Engineering, Chinese Academy of Sciences, National Engineering Laboratory for Information Security Technologies, Beijing, China;2. Institute of Microelectronics, Tsinghua University, Beijing, China;3. Key Lab. of Intelligent Information Processing, Institute of Computing Technology, Chinese Academy of Sciences, Beijing, China;4. School of Information Science and Engineering, Shandong Normal University, Jinan, China;5. Department of Computer Science and Technology, Beijing University of Chemical Technology, Beijing, China;6. State Key Laboratory of Computer Architecture, Institute of Computing Technology, Chinese Academy of Sciences, Beijing, China;1. CAS Key Laboratory of Mechanical Behavior and Design of Materials, University of Science and Technology of China, Hefei, China;2. Department of Architecture and Civil Engineering, City University of Hong Kong, Kowloon, Hong Kong Special Administrative Region;3. College of Information Technology, Shanghai Ocean University, Shanghai 201306, China;4. City University of Hong Kong Shenzhen Research Institute Building, Shenzhen Hi-Tech Industrial Park, Nanshan District, Shenzhen, China;1. DeVry University, Chicago Campus, 3300 North Campbell Avenue, Chicago 60618, USA;2. ICube, University of Strasbourg, CNRS, UMR 7537, 300 Boulevard Sébastien Brant, BP 10413, 67412 Illkirch Cedex, France;1. Department of Computer Science, University of Cape Town, Rondebosch, 7700, South Africa;2. Rhodes Centre for Radio Astronomy Techniques and Technologies, Rhodes University, Grahamstown, 6140, South Africa;3. Department of Physics & Astronomy, University of the Western Cape, Private Bag X17, Bellville, 7535, South Africa;4. Department of Astronomy, University of Cape Town, Rondebosch, 7700, South Africa;5. Department of Physics and Electronics, Rhodes University, PO Box 94, Grahamstown, 6140, South Africa;6. GEPI, Observatoire de Paris, CNRS, Université Paris Diderot, 5 place Jules Janssen, 92190 Meudon, France;7. SKA South Africa, 3rd Floor, The Park, Park Road, Pinelands, 7405, South Africa;1. CSIRO Computational Informatics, Postal Bag 33, South Clayton VIC 3169, Australia;2. CSIRO Computational Informatics, GPO Box 664, Canberra ACT 2601, Australia
Abstract:For increasingly miniaturized micromechanical sensors the silicon package is thinned and therefore more sensitive to thermomechanical stresses caused by the production stages. We present a four-point-bending-test that enables the investigation of reliability relevant loading like warping. The initiation of crack growth at the glass frit bonding frame is observed by an infrared camera and critical fracture mechanical parameters are determined for different tensile and shear mode contributions. Based on this crucial fracture mechanical data the stability of silicon packages can be assessed.
Keywords:
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