Effect of tungsten addition on thermal conductivity of graphite/copper composites |
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| Affiliation: | 1. College of Materials Science and Engineering, Key Laboratory of Advanced Functional Materials, Ministry of Education of China, Beijing University of Technology, 100124 Beijing, PR China;2. School of Materials Science and Engineering, Xi''an University of Technology, Xi''an 710048, PR China |
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| Abstract: | Graphite/copper composites with high thermal conductivity were fabricated by tungsten addition, which formed a thin tungsten carbide layer at the interface. The microstructure and thermal conductivity of the composite material were studied. The results indicated that the insertion of tungsten carbide layer obviously suppressed spheroidization of copper coating on the graphite particles during the sintering process, and decreased the interfacial thermal resistance of the composites. Compared with the graphite/copper composites without tungsten, the thermal conductivity of the obtained composites was increased by 43.6%. |
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| Keywords: | A Metal–matrix composites (MMCs) E Surface treatments B Interface B Thermal properties |
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