| 紫铜低硝酸化学抛光的定量研究 |
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| 引用本文： | 方景礼,韩克平.紫铜低硝酸化学抛光的定量研究[J].电镀与精饰,1995,17(5):8-11. |
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| 作者姓名： | 方景礼 韩克平 |
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| 作者单位： | 南京大学应用化学研究所 210093
(方景礼)，南京大学应用化学研究所 210093(韩克平) |
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| 摘 要： | 用光反射率法和重量法定量研究了紫铜的化学抛光液中各组分和操作条件对抛光效果的影响，得出了最佳的抛光工艺，该抛光工艺具有光亮度高，污染低等优点。
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| 关 键 词： | 紫铜 化学抛光 反射率 重量法 |
A Q uantitative Study on Chemical Polishing with Low Nitric Acid Content for Copper |
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| Fang Jingli and Han Kepin.A Q uantitative Study on Chemical Polishing with Low Nitric Acid Content for Copper[J].Plating & Finishing,1995,17(5):8-11. |
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| Authors: | Fang Jingli and Han Kepin |
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| Abstract: | The influences of the chemical polishing solution componets and operating conditions on the polishing effect of copper were studied quantitatively by reflectivity and gravimetric method. The optimum polishing technology has been obtained with the virtue of high bright surface and low pollution. |
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| Keywords: | copper chemical polishing reflectivity gravimetric method |
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