| 单组份环氧树脂-银导电胶的制备研究 |
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| 引用本文： | 王萍,金石磊,李小慧,顾哲明.单组份环氧树脂-银导电胶的制备研究[J].广州化工,2011,39(5):62-64. |
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| 作者姓名： | 王萍 金石磊 李小慧 顾哲明 |
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| 作者单位： | 上海材料研究所,上海工程材料应用评价重点实验室,上海,200437 |
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| 摘 要： | 选用微米级片状银粉作为导电填料,环氧树脂和咪唑类潜伏型固化剂作为基体树脂制备导电胶。通过扫描电镜研究了银粉含量对导电胶固化后的形貌,测试体积电阻率和拉伸性能与银粉填充量变化的关系。依照以上结论,探讨了导电胶的导电机理,并提出导电模型。
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| 关 键 词： | 导电胶 体积电阻率 拉伸性能 导电机理 |
Study on One Part Epoxy- Ag Conductive Adhesive |
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| WANG Ping,JIN Shi-lei,LI Xiao-hui,GU Zhe-ming.Study on One Part Epoxy- Ag Conductive Adhesive[J].GuangZhou Chemical Industry and Technology,2011,39(5):62-64. |
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| Authors: | WANG Ping JIN Shi-lei LI Xiao-hui GU Zhe-ming |
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| Affiliation: | (Shanghai Research Institute of Material,Shanghai Key Laboratory for Engineering Materials Evaluation, Shanghai 200437,China) |
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| Abstract: | The conductive adhesive was prepared by using micron flake Ag powder as conductive filler,and epoxy resin and imidazole curing agent as resin matrix.The effect of the content of Ag on the morphology,volume resistivity and tensile property were studied by scanning electrical microscopy.Based on the conclusion,the conductive mechanism was discussed. |
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| Keywords: | conductive adhesive volume resistivity tensile property conductive mechanism |
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