Pressure Sensitive Adhesives Based on VectorR SIS Polymers I. Rheological Model and Adhesive Design Pathways |
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Authors: | M F Tse L Jacob |
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Affiliation: |
a Polymer Science Division, Baytown Polymers Center, Exxon Chemical Company, Baytown, Texas, USA
b Adhesion Industry Business Unit, Machelen Chemical Technology Center, Exxon Chemical Europe Inc., Machelen, Belgium |
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Abstract: | Dexco Polymers (a Dow/Exxon partnership) has been manufacturing VectorR SIS polymers since 1990.1 This paper describes experiments carried out to study Vector SIS polymers and model pressure sensitive adhesive (PSA) formulations based on Exxon Chemical's EscorezR 1310LC tackifier. The adhesive behavior of tackified polymers was quantitatively analyzed by applying the rheological principle of time-temperature superposition2 and the mapping approach,3,4 and the pressure sensitive rheological model5 developed earlier. This model5 was developed by expanding and modifying an equation adhesive fracture strength = (intrinsic adhesion) × (bulk energy dissipation)] proposed by Gent et al.6,7 and Andrews et al.8,9 This study delivers two key results. The first is that the fracture strength of the PSA/steel bond is the multiplication of three terms: the intrinsic (or interfacial) adhesion, the bonding and the debonding terms (Fig. 1). The debonding term is correlated with the logarithm of the loss modulus at the PSA debonding frequency or with the logarithm of the monomeric friction coefficient of the block copolymer/tackifier system. Both the loss modulus and the monomeric friction coefficient measure the energy dissipation in the bulk adhesive. The second is that PSA design pathways can be established by a mapping approach in the rheological space of the plateau modulus versus the loss modulus peak position in the frequency scale (Fig. 2). Plateau modulus is the bonding parameter because it measures the wetting capability of the adhesive with the substrate surface. The loss modulus peak position is the debonding parameter because it corresponds approximately to the time scale (or the frequency scale) in which one deforms the adhesive to maximize energy dissipation. Therefore, the tackifier and oil combination lowers the plateau modulus, but increases the Tg of the polyisoprene phase of the SIS polymer. This increase in Tg is equivalent to the lowering of the rate of local rearrangement (frequency of segment jumps) of the polyisoprene chains of the block copolymer. An optimal “tackification pathway” in this rheological space is achieved by tailoring the tackifier type and Tg, and the amount of oil used in the PSA.
In brief, the PSA rheological model and mapping approach described in this work for Vector SIS polymers give a comprehensive understanding and adhesive design pathways. This concept and approach not only allow raw material suppliers to improve and design better tackifier and polymer products, but also provide PSA formulators a quantitative tool to achieve PSA end property results. |
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Keywords: | Pressure sensitive adhesive block copolymer tackifier adhesion tack rheology time-temperature superposition storage modulus loss modulus |
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