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Infrared thermography for inspecting the adhesion integrity of plastic welded joints
Authors:M Omar  M Hassan  K Donohue  K Saito  R Alloo
Affiliation:aMechanical Engineering Department, University of Kentucky, Lexington KY 40506, USA;bElectrical Engineering Department, University of Kentucky, Lexington KY 40506, USA;cToyota Motor Manufacturing North America Inc., Erlanger KY 41018, USA
Abstract:This work aim at developing a non-destructive tool for the evaluation of bonded plastic joints. The paper examines infrared thermographic transmission and reflection mode imaging and validates the feasibility of the thermal NDT approach for this application. Results demonstrate good estimation performance for adhesion integrity, uniformity and bond strength using a transmission mode application of infrared thermography. In addition, results from a pulsed infrared thermographic application using a modified dynamic infrared tomography scheme show good performance for estimating adhesion layer thickness mapping and detecting delaminations.
Keywords:Plastic kissing bonds  Adhesion uniformity  Bond strength  Pull force  Dynamic tomography  Delaminations detection
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