Dissolution behavior of Cu and Ag substrates in molten solders |
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| Authors: | Po-Yi Yeh Jenn-Ming Song Kwang-Lung Lin |
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| Affiliation: | (1) Department of Materials Science and Engineering, National Cheng Kung University, 701 Tainan, Taiwan;(2) Department of Materials Science and Engineering, National Dong Hwa University, 974 Hualien, Taiwan |
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| Abstract: | This study investigated the dissolution behavior of Cu and Ag substrates in molten Sn, Sn-3.5Ag, Sn-4.0Ag-0.5Cu, Sn-8.6Zn
and Sn-8.55Zn-0.5Ag-0.1Al-0.5Ga lead-free solders as well as in Sn-37Pb solder for comparison at 300, 350, and 400°C. Results
show that Sn-Zn alloys have a substantially lower dissolution rate of both Cu and Ag substrates than the other solders. Differences
in interfacial intermetallic compounds formed during reaction and the morphology of these compounds strongly affected the
substrate dissolution behavior. Soldering temperature and the corresponding solubility limit of the substrate elements in
the liquid solder also played important roles in the interfacial morphology and dissolution rate of substrate. |
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| Keywords: | Dissolution Pb-free solder interface intermetallic compounds |
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