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| 精细导线印制板图像转移工艺研究与实践 | |
| 引用本文： | 李玢. 精细导线印制板图像转移工艺研究与实践[J]. 印制电路信息, 2003, 0(7): 32-33,35 |
| 作者姓名： | 李玢 |
| 作者单位： | 中国航空工业第六三一研究所,710068 |
| 摘 要： | 如何改进细导线印制板图像转移工艺,以便生产出高品质的PCB产品,PCB生产者面对的一个难题。通过多次实践操作与试验以及理论分析,主要解决了三个技术问题;材料的选择;图像转移的过程控制;湿处理工艺参数的确定。 |
| 关 键 词： | 印制板 精细导线 侧蚀量 |
| 修稿时间： | 2003-03-19 |
The Research and Application about Image Transfer Process of the Fine-line Printed Circuit Board |
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| Li Bing. The Research and Application about Image Transfer Process of the Fine-line Printed Circuit Board[J]. Printed Circuit Information, 2003, 0(7): 32-33,35 | |
| Authors: | Li Bing |
| Abstract: | How improve the current process of the fine-line PCB image transfer in order to produce next generation fine-line PCB products is a challenge faced by many manufactures. Based on several experiments and theory analyses,the author solved three technical questions,the select of material, the control process of image transfer,proved the process window of wet process. |
| Keywords: | printed circuit board fine-line undercut |
| 本文献已被 CNKI 维普 万方数据 等数据库收录！ | |