The Shear Stress-Strain Behaviour of Low-modulus Structural Adhesives |
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Authors: | F Kadioglu R D Adams F J Guild |
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Affiliation: |
a Composites and Adhesives Group, Department of Mechanical Engineering, University of Bristol, Bristol, UK |
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Abstract: | The shear stress-strain behaviour of two low-modulus structural adhesives has been measured using the butt-torsion test. The Nadai correction for non-linear shear behaviour is explained as it is necessary to understand how this correction can be applied to butt joints. The results for one adhesive were accurately used to predict the strength of a lap joint, and it was shown that the strength of such a joint can approach that of a conventional, modern, structural epoxy. Structural adhesives are usually reckoned to be those with a high strength (50 MPa and upwards) and (these days), a strain to failure of at least 10% in tension, and which usually have a tensile modulus of 2 GPa or so. However, adhesives which are significantly less stiff, less strong, but much more ductile are entering the 'structural' arena. In order to evaluate their effectiveness and use in design, it is necessary to be able to measure accurately their stress-strain behaviour. Two such materials are 3M 9245 Structural Bonding Tape (SBT) and 3M 7838 B/A. |
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Keywords: | Butt joint Shear test Low-modulus structural adhesives Structural bonding tape |
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