机载电子设备BGA封装热设计

由于表贴器件制造公差的影响，器件与冷板间的接触热阻无法有效控制。器件上方直接安装散热冷板的方法不能满足大热耗BGA封装器件的散热要求。介绍一种“活塞”式导热组件，充分考虑了上述因素，有效控制了器件与冷板间热阻。经过理论计算和实验验证，能够满足较大热耗器件在密封机载电子设备内的散热要求。

Thermal Design of BGA Package for Avionics

Because of the influences of such factors as machining tolerance etc. , the contact thermal resistance between chip and cold plate can＇t be controlled effectively. The method of installing a cold plate on the chip surface can＇t meet the cool thermal conduction module ing wh requirements to high power BGA chip. In this paper, a so called ＂PISTON＂ ich fully considers these factors is introduced. By thermal performance calculation and test, it is shown that this structure can meet the chip＇s cooling requirements to sealed avionics.