大屯锡矿尾砂膏体环管管输数值模拟研究

膏体管输沿程阻力是影响管道设计与采场充填质量的关键因素之一，本文采用fluent建立与实际环管实验系统一样的管道输送的几何模型，分析得到不同管线沿程阻力损失之间的关系以及膏体配比参数对沿程阻力损失的影响规律。 研究表明：膏体在管道中弯管处的速度和压力都发生急剧的变化，弯管外侧压力和速度明显大于弯管内侧，有着明显的梯度。在水平管段速度和压力在管道径向上存在明显的梯度，呈结构流的特点，分为柱塞流动区和边界层区域。在膏体管道输送中管道内膏体的速度和压力均存在着边界效应，随着流速的增大管输阻力增大；随着膏体质量浓度增加，沿程管道阻力损失变大；随着屈服应力与塑性粘度的增加沿程阻力损失也增大，获得了不同物料组成、管道内径、管流流速下水平段膏体压力损失，为大屯锡矿最终输送泵、充填管道选型提供了依据。

Numerical simulation study on the pipeline transportation of tailings paste in Datun tin mine

The resistance along the transportation path of the paste pipeline is one of the key factors affecting pipeline design and filling quality in the mining area, This article uses fluent to establish a geometric model of pipeline transportation similar to the actual loop experimental system, Analyze the relationship between resistance losses along different pipelines and the influence of paste ratio parameters on resistance losses along the pipeline. Research has shown that: The velocity and pressure of the paste at the bend in the pipeline undergo sharp changes, with the pressure and velocity on the outer side of the bend being significantly greater than on the inner side, showing a significant gradient. There is a significant gradient in velocity and pressure in the radial direction of the horizontal pipe section, which is characterized by structural flow and is divided into a plunger flow zone and a boundary layer zone. In the pipeline transportation of paste, there is a boundary effect on the velocity and pressure of the paste inside the pipeline. As the flow rate increases, the pipeline resistance increases; As the mass concentration of the paste increases, the resistance loss along the pipeline increases; As the yield stress and plastic viscosity increase, the resistance loss along the way also increases, Obtained the pressure loss of the paste in the horizontal section of different material compositions, pipeline inner diameters, and pipeline flow rates, providing a basis for the selection of the final transport pump and filling pipeline in Datun Tin Mine.