| LED封装中的散热研究 |
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| 引用本文： | 张楼英,李朝林.LED封装中的散热研究[J].电子与封装,2009,9(5):1-4. |
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| 作者姓名： | 张楼英 李朝林 |
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| 作者单位： | 准安信息职业技术学院,江苏淮安,223003 |
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| 摘 要： | 文章论述了大功率LED封装中的散热问题，说明它对器件的输出功率和寿命有很大的影响，分析了小功率、大功率LED模块的封装中的散热对光效和寿命的影响。对封装及应用而言，增强它的散热能力是关键技术，指出对大功率LED和LED模块散热设计很重要，因为大功率白光LED的光效和寿命取决于其散热。目前大功率LED的重点是提高散热能力，说明封装结构和封装材料在提高大功率LED散热中的影响，LED模块的散热是未来的重点。通过选用高热导率材料可以使温度得到显著控制，重点论述了封装的关键技术，最后指出了未来LED封装技术的发展趋势。
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| 关 键 词： | 大功率LED 封装 散热 材料 结构 |
Research on Heat-release Package of LED |
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| ZHANG Lou-ying,LI Chao-lin.Research on Heat-release Package of LED[J].Electronics & Packaging,2009,9(5):1-4. |
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| Authors: | ZHANG Lou-ying LI Chao-lin |
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| Affiliation: | ( Huai＇ an College of lnformation Technology, Huai＇ an 223003, China) |
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| Abstract: | Thermal dissipation in high-power is discoursed; it explained its influence on output power and life. The influence of luminous efficiency and life in low power LED, high power LED and high power LED module is analyzed. How to improve the heat-release capability is one of the key technical problems for the package and application design of device concerned with high-power LEDs. Thermal dissipation is important for power LED and LED module design because luminous efficiency and lifetime of high-power white L... |
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| Keywords: | high-power LED package heat release material structure |
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