有机硅硼改性环氧树脂胶粘剂的研制

以环氧树脂(EP)和有机硅硼改性EP预聚物为主体材料,研制出一种可室温固化、高温使用且固化压力仅为接触压力的胶粘剂。并通过SEM、热重分析法和力学性能测试等手段对该胶粘剂的性能进行了研究。实验结果表明,有机硅硼改性EP预聚物与纯EP相容性很好,有机硅硼的加入明显提高了EP的韧性、耐热性和力学性能(尤其是高温时的剪切强度);当m(EP)∶m(有机硅硼改性EP预聚物)=100∶40时,剪切强度为14.84 MPa(20℃)和4.88 MPa(100℃),与未改性前相比,高温时的强度损失率由改性前的81.0%降低至67.1%;该胶粘剂可在100℃时长期使用,短期可耐150℃的高温。

Study on organic silicon-boron modified epoxy resin adhesive

The adhesive which can be cured at room temperature,used at high temperature,only contact pressure was prepared with epoxy resin(EP) and organic silicon-boron modified EP prepolymer as matrix.The performance of modified EP adhesive was analyzed by SEM,TG and mechanical property testing respectively.The experimental results showed that the compatibility between organic silicon-boron modified EP prepolymer and pure EP was excellent.The toughness,heat-resistance and mechanical property(especial shear strength at high temperature) of EP was improved remarkably by accession organic boron-silicon.When mass ratio of EP and organic silicon-boron modified EP prepolymer was 100∶40,the shear strength were 14.84 MPa at 20 ℃ and 4.88 MPa at 100 ℃ respectively.The strength loss at high temperature was minished to 67.1% from 81.0% compared with unmodified adhesive.The adhesive may use for long term at 100 ℃,for short term at 150 ℃.