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Stochastic Models for Pad Structure and Pad Conditioning Used in Chemical-Mechanical Polishing
Authors:Susanne Wiegand  Dietrich Stoyan
Affiliation:(1) Siltronic AG, 09599 Freiberg, Germany;(2) Faculty of Mathematics and Computer Science, Freiberg University of Mining and Technology, 09599 Freiberg, Germany
Abstract:Stochastic models are presented for the structure and conditioning of pads used in chemical-mechanical polishing of wafers. First the one-dimensional distribution function of surface depth in the case of a conditioned solid pad is described. Then, for characterizing the structure of a foamed pad, the theory of random closed sets is applied. An important distributional characteristic of a random closed set, the linear contact distribution function, yields the contribution to surface depth resulting from pores. As a special example the Boolean model is considered. This leads to a formula that describes the variability of the surface of a conditioned foamed pad after a certain time. Simulations and experimental data show a good agreement between theory and reality.
Keywords:chemical-mechanical polishing  conditioning  pad  stochastic models  surface roughness
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