Microstructure, creep properties, and failure mechanism of SnAgCu solder joints |
| |
| Authors: | Janne J Sundelin Sami T Nurmi Toivo K Lepistö Eero O Ristolainen |
| |
| Affiliation: | (1) Institute of Materials Science, Tampere University of Technology, P.O. Box 589, FIN-33101 Tampere, Finland;(2) Institute of Electronics, Tampere University of Technology, P.O. Box 692, FIN-33101 Tampere, Finland |
| |
| Abstract: | The effect of microstructure on the creep properties and the failure mechanism of SnAgCu solder joints was studied. Single
overlap shear specimens made of FR-4 printed circuit boards (PCBs) with organic solderability preservative (OSP), NiAu, and
immersion Sn surface finish were reflow-soldered with hypoeutectic, eutectic, and hypereutectic SnAgCu solder paste. Creep
tests of the solder joints were performed at 85°C and 105°C under constant load. The effect of microstructure on the creep
behavior of the joints was studied by examining the fracture surfaces and cross-sectional samples of the tested joints. Results
show that the intermetallic compound at the interface between the PCB and solder affects the fracture behavior of SnAgCu solder
joints, thus creating a significant difference in the creep properties of solder joints on different surface finishes. Composition
of SnAgCu solder was also found to affect the creep properties of the joints. |
| |
| Keywords: | Lead-free solder creep SnAgCu |
| 本文献已被 SpringerLink 等数据库收录！ |
|
