| 铜粉导电胶的研究进展 |
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| 引用本文： | 王刘功,银锐明,杨华荣,刘飘,杨开霞.铜粉导电胶的研究进展[J].广东化工,2011,38(1):84-86. |
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| 作者姓名： | 王刘功 银锐明 杨华荣 刘飘 杨开霞 |
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| 作者单位： | 王刘功,银锐明,Wang Liugong,Yin Ruiming(湖南工业大学,包装与材料工程学院,湖南,株洲,412008);杨华荣,刘飘,杨开霞,Yang Huarong,Liu Piao,Yang Kaixia(湖南利德电子浆料有限公司,湖南,株洲,412007) |
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| 基金项目： | 2009年湖南省科技计划项目 |
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| 摘 要： | 铜粉导电胶粘剂的发展对电子技术的发展有着非常重要的意义。介绍了铜粉导电胶的分类、组成及铜粉导电胶的研究现状,综述了铜粉导电胶在电学性能、力学性能、老化性能等方面的研究进展。最后对铜粉导电胶存在的问题及其今后的研究方向进行了展望。
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| 关 键 词： | 铜粉导电胶 组成 导电性 研究现状 |
Progress in Copper Conductive Adhesive |
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| Wang Liugong,Yin Ruiming,Yang Huarong,Liu Piao,Yang Kaixia.Progress in Copper Conductive Adhesive[J].Guangdong Chemical Industry,2011,38(1):84-86. |
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| Authors: | Wang Liugong Yin Ruiming Yang Huarong Liu Piao Yang Kaixia |
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| Affiliation: | 1.College of Packaging and Materials Engineering,Hunan University of Technology,Zhuzhou 412008; 2.Hunan LEED Thick Film Paste Co.,Ltd.,Zhuzhou 412007,China) |
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| Abstract: | The development of copper conductive adhesive has great importance in the development of electronic technique.In the paper,the constitution,classes and recent advances in the research on copper conductive adhesive were briefly introduced.The research progress of electrical performance,mechanics performance and ageing performance for copper conductive adhesive were summarized.It also presented the problems of copper conductive adhesive and the prospect ofresearch direction. |
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| Keywords: | copper conductive adhesive composition conductivity research progress |
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