| Abstract: | A new type of metallizition technology for ceramic circuit substrates which has advantages of both thick and thin film process has been deve-loped.The etching behavior of ceramic substrates was studied by SEM. The adhersion strength,solderability,sheet resistance,thermal conductivity and loss at microwave frequencies were determined. Furthermore, the temperature cycling and aging and other reliability tests were performed. The results of test and application show that by using this technology copper circuit patterns with strong adhersion can be fabricated onto the alumina ceramic substrates, which has excellent mechanical,electrical and thermal performance and good reliabili-ty,and which opens a new way for metallizition technology for microwave and hvbrid IC substrates. |
