| SMD真空无钎剂激光软钎焊试验研究与机理分析 |
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| 引用本文： | 冯武锋,王春青,李明雨,谢孝秋,韩鹏飞.SMD真空无钎剂激光软钎焊试验研究与机理分析[J].电子工艺技术,1999,20(1):1-5,11. |
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| 作者姓名： | 冯武锋 王春青 李明雨 谢孝秋 韩鹏飞 |
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| 作者单位： | 1. 哈尔滨工业大学现代焊接生产技术国家重点实验室,150001
2. 大庆毛纺集团公司 |
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| 摘 要： | 元钎剂软钎焊技术可以从根本上解决因钎剂的副作用而带来的一系列问题,本文主滇 空无钎钎焊可行性进行试验研究及真空的元钎剂作用机理分析,并将该技术成功地应用于片式电阻元件的表面组装中。
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| 关 键 词： | 真空 无钎剂软钎焊 |
Test Research and Mechanism Analysis of Vacuum Fluxless Laser Soldering for SMD |
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| Feng Wufeng,Wang Chunqing,Li Mingyu,Xie Xiaoqiu,Han Pengfei.Test Research and Mechanism Analysis of Vacuum Fluxless Laser Soldering for SMD[J].Electronics Process Technology,1999,20(1):1-5,11. |
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| Authors: | Feng Wufeng Wang Chunqing Li Mingyu Xie Xiaoqiu Han Pengfei |
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| Affiliation: | Feng Wufeng Wang Chunqing Li Mingyu Xie Xiaoqiu (Harbin Institute of Technology) Han Pengfei(Daqing Wool Spinning Corporation) |
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| Abstract: | Fluxless soldering can solve a series of problems caused by the side effect of flux essentially.The feasibility research on vacuum fluxless laser soldering and mechanism analysis on fluxless action of vacuum were carried out.What's more,this fluxless technology was applied in surface mounting of chip resistance successfully. |
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| Keywords: | SMD |
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