Low-cycle fatigue properties of eutectic solders at high temperatures |
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| Authors: | YOSHIHARU KARIYA TADATOMO SUGA |
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| Affiliation: | Department of Materials Science and Engineering, Shibaura Institute of Technology, Toyosu 3-7-5, Kouto-ku, Tokyo 135-8545, Japan;, School of Engineering, The University of Tokyo, Hongo 7-3-1, Bunkyo-ku, Tokyo 113-8656, Japan |
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| Abstract: | This paper details the deformation mechanism and low‐cycle fatigue life of eutectic solder alloys at high temperature (around 0.8Tm). Grain boundary sliding generally nucleates a wedge‐type cavity that reduces the low‐cycle fatigue life of metals. In this study, grain boundary sliding has promoted intergranular failure contributing to the reduction in fatigue life of Sn–Ag–Cu alloy. However, grain boundary sliding has exerted no deleterious effects on fatigue resistance of eutectic Pb–Sn and Bi–Sn alloys. The phase boundary sliding with very fine microstructure induces exceptional ductility in these alloys leading to superior low‐cycle fatigue endurance for theses eutectic Pb–Sn and Bi–Sn alloys. |
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| Keywords: | creep grain boundary sliding lead-free solder low-cycle fatigue Sn–3 0Ag–0 5Cu Sn–37Pb Sn–57Bi miniature testing |
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