| 化学镀及化学处理取代热风整平工艺探讨 |
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| 引用本文： | 刘仁志,杨磊.化学镀及化学处理取代热风整平工艺探讨[J].电镀与精饰,2004,26(2):16-19. |
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| 作者姓名： | 刘仁志 杨磊 |
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| 作者单位： | 武汉凡谷电子技术股份有限公司,湖北,武汉,470015;武汉凡谷电子技术股份有限公司,湖北,武汉,470015 |
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| 摘 要： | 热风整平工艺一直是印刷线路板制作中重要的后处理工艺，但是，随着印刷线路板的精细化和环境保护的需要，热风整平工艺的应用已经受到限制。由此，产生了一些替代工艺，包括化学防氧化、化学镀镍／金、化学镀锡及锡合金等。其中化学镀锡及锡合金最有可能成为取代热风整平的主流工艺。
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| 关 键 词： | 印刷线路板 热风整平 化学镀 化学处理 |
| 文章编号： | 1001-3849(2004)02-0016-04 |
| 修稿时间： | 2003年3月6日 |
On the Displacement of Hot Air Leveling by Electroless Plating and Chemical Process |
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| LIU Ren-zhi,YANG Lei.On the Displacement of Hot Air Leveling by Electroless Plating and Chemical Process[J].Plating & Finishing,2004,26(2):16-19. |
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| Authors: | LIU Ren-zhi YANG Lei |
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| Abstract: | Hot air leveling (HAL) process is the important final treatment during the PCB (printed circuit boards) producing process. However, with the reducing in size or increasing in complexity of the printed circuit boards and the need of environment protection, the application of HAL process has been limited. Some substituent processes has been created therefrom. Among them, the tin and tin alloy electroless plating process is the most promising one that will displace HAL process. |
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| Keywords: | printed circuit boards hot air leveling electroless plating chemical treatment |
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