| CBGA不同尺寸焊点热循环载荷下应力应变的有限元模拟 |
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| 引用本文： | 胡永芳,薛松柏,禹胜林.CBGA不同尺寸焊点热循环载荷下应力应变的有限元模拟[J].焊接学报,2005,26(10):97-100. |
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| 作者姓名： | 胡永芳 薛松柏 禹胜林 |
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| 作者单位： | 1. 南京航空航天大学,材料科学与技术学院,南京,210016
2. 中国电子科技集团,第十四研究所,南京,210013 |
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| 摘 要： | 采用ANSYS分析软件，将组件简化为二维模型的焊点应力应变有限元分析。通过研究三种BGA球（0．76mm、1．0mm、1．3mm）组件，利用有限元模拟CBGA（陶瓷球栅阵列）组件在热循环加载条件下其应力应变分布，并且计算了焊点的应力应变最大值，得出球径为0．76min的CBGA组件其可靠性最好，表明有限元方法可有效地用于研究微电子封装中各类焊点的可靠性。
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| 关 键 词： | 陶瓷球栅阵列 应力 应变 有限元分析 |
| 文章编号： | 0253-360X（2005）10-97-04 |
| 收稿时间： | 07 29 2005 12:00AM |
| 修稿时间： | 2005-07-29 |
FEM analysis of stress and strain in CBGA solder joint with different size under thermal cycle |
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| HU Yong-fang,XUE Song-bai and YU Sheng-lin.FEM analysis of stress and strain in CBGA solder joint with different size under thermal cycle[J].Transactions of The China Welding Institution,2005,26(10):97-100. |
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| Authors: | HU Yong-fang XUE Song-bai and YU Sheng-lin |
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| Affiliation: | HU Yong-fang~1,XUE Song-bai~1,YU Sheng-lin~2 |
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| Abstract: | The components of CBGA was simplified into 2-D model of finite element analysis for the stress and strain of soldered joint,and the finite element method was used to simulate the distribution of stress and strain of three kinds of CBGA components(0.76 mm,1.0 mm and 1.3 mm) under thermal cycle,and calculate the maximum of stress and strain.The results show that the reliability of CBGA components with(0.76 mm) diameter is the best and the analysis indicates the finite element simulation is suitable for studying reliability of all kinds of soldered joints in packaging of microelectronics. |
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| Keywords: | CBGA stress strain FEM analysis |
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