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| 基于CMOS激光位移传感器的板厚测量系统 | |
| 引用本文： | 雷霆,秦东兴,胡峰,金伟. 基于CMOS激光位移传感器的板厚测量系统[J]. 自动化与仪器仪表, 2012, 0(5): 144-145 |
| 作者姓名： | 雷霆 秦东兴 胡峰 金伟 |
| 作者单位： | 电子科技大学 四川成都,611731 |
| 摘 要： | 为了提高板材厚度参数的测量效率和精度,本系统利用CMOS激光位移传感器,通过激光三角法实现板材厚度的测量,并利用MPC08运动控制卡控制交流伺服系统实现激光位移传感器的测量定位,同时计算机对采集数据进行分析处理、显示和存储.实验表明该系统运行稳定可靠,测量效率大幅提高. |
| 关 键 词： | 运动控制卡 板厚测量 激光三角法 非接触 CMOS |
Based on CMOS laser displacement sensor plate thickness measurement system |
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| Affiliation: | Lei Ting,Qing Dong-xing,Hu Feng,etal. |
| Abstract: | In order to improve the efficiency and precision of plate thickness measurement, the system uses CMOS laser displace- ment sensors, through laser triangulation method to realize plate thickness measurement, and the use of MPC08 motion conlrol card to control AC servo system of laser sensor measuring position, at the same time the computer to analyze the data processing, display and storage. Experiments show that the system runs stably and reliably, a substantial increase in efficiency measurement. |
| Keywords: | Motion control card Thickness measurement Laser triangulation Non-contact CMOS |
| 本文献已被 CNKI 维普 万方数据 等数据库收录！ | |