| Al基上偏压磁控溅射Cu薄膜的工艺研究 |
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| 引用本文： | 余凤斌,陈莹,曾海军,夏祥华,李建国,孙业雷.Al基上偏压磁控溅射Cu薄膜的工艺研究[J].稀有金属快报,2008,27(9):35-38. |
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| 作者姓名： | 余凤斌 陈莹 曾海军 夏祥华 李建国 孙业雷 |
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| 作者单位： | 1. 山东天诺光电材料有限公司,山东,济南,250101
2. 山东现代职业学院,山东,济南,250100 |
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| 基金项目： | 国防科技应用基础研究基金，河南省济南市科技攻关项目 |
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| 摘 要： | 利用磁控溅射方法，通过对衬底施加负偏压吸引等离子体中的阳离子对衬底进行轰击，在Al箔上制备Cu薄膜。采用强力胶带试验及数字式微欧计考察了负偏压对薄膜附着力和方块电阻的影响，以及Cu薄膜的氧化规律。结果表明，样品的附着力随负偏压的增大先急剧增加，后又下降，负偏压为200V时附着力最强，为76N；方块电阻则随负偏压的增大先下降，在200V达到最小值1．575Ω/□，而后又增大；Cu薄膜的氧化反应完成的时间与Cu膜厚度基本呈线性规律。
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| 关 键 词： | Al基Cu薄膜 磁控溅射 附着力 方块电阻 动力学杼眭 |
Characterization of Al-Cu Composite Film Prepared by Bias Magnetron Sputtering |
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| Yu Fengbin,Chen Ying,Zeng Haijun,Xia Xianghua,Li Jianguo,Sun Yelei.Characterization of Al-Cu Composite Film Prepared by Bias Magnetron Sputtering[J].Rare Metals Letters,2008,27(9):35-38. |
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| Authors: | Yu Fengbin Chen Ying Zeng Haijun Xia Xianghua Li Jianguo Sun Yelei |
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| Affiliation: | Yu Fengbin, Chen Ying, Zeng Haijun, Xia Xianghua, Li Jianguo, Sun Yelei (1. Shandong Tiannuo Photoelectric Material Co., Ltd., Jinan 250101, China;2. Shandong Modem Vocational College, Jinan 250100, China) |
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| Abstract: | A Al-Cu composite films with good adhesion were prepared by using bias magnetron sputtering which can lead cation in plasma to struck substrate. A powerful adhesive tape test was used to observe the effect of the bias on the film adhesion, and a digital micro-ohmmeter was used to measure the impact of the bias on resistance and film oxidation kinetics law. The results showed that： with increasing the bias, film adhesion increases dramatically first and then declines, and film resistance drops first until to reach the minimum value of 1.575 ohm at 200 V and then increases. The oxidation kinetics of the conner films was studied via sheet resistance. |
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| Keywords: | Al-based Cu film magnetrol sputtering adhesive force sheet restance kinetics characterization |
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