| 高厚径比盲孔电镀 |
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| 引用本文： | 朱斌. 高厚径比盲孔电镀[J]. 印制电路信息, 2006, 0(1): 36-39,51 |
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| 作者姓名： | 朱斌 |
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| 作者单位： | 江南计算技术研究所,214083 |
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| 摘 要： | 盲孔能够大大的增加板的密度,从而减小板面积。介绍了有关高厚径比盲孔电镀的有关工艺,从激光钻孔、金属化孔和电镀几个方面对孔径4mil以上的盲孔电镀进行了研究。
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| 关 键 词： | 高厚径比 盲孔电镀 |
Plating High Aspect Ratio Blind Vias |
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| Zhu Bin. Plating High Aspect Ratio Blind Vias[J]. Printed Circuit Information, 2006, 0(1): 36-39,51 |
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| Authors: | Zhu Bin |
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| Abstract: | Blind vias can vastly increase densities on panels,thereby reducing their size.It is described the technology of plating high aspect blind vias in this paper,especially of plating blind vias which sizes of 4 mils and above,utilizing different laser drilling,metallization and plating. |
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| Keywords: | high aspect plating blind vias |
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