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Finite element analysis of interface delamination and buckling in thin film systems by wedge indentation |
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| Authors: | P. Liu Y.W. Zhang C. Lu |
| Affiliation: | a Institute of High Performance Computing, 1 Science Park Road, #01-01 The Capricorn, Singapore Science Park II, 117528 Singapore, Singapore b Department of Materials Science and Engineering, National University of Singapore, Singapore c Department of Mechanical Engineering, National University of Singapore, Singapore d School of Mechanical and Aerospace Engineering, Nanyang Technological University, Singapore |
| Abstract: | A finite element method is used to study the interface delamination and buckling of thin film systems subject to microwedge indentation. In the formulation, the interface adjoining the thin film and substrate is assumed to be the only site where cracking may occur. Both the thin film and the substrate are taken to be ductile materials with finite deformation. A traction-separation law, with two major parameters: interface strength and interface energy, is introduced to simulate the adhesive and failure behaviors of the interface between the film and the substrate. The effects of the interface adhesive properties and the thickness of the thin film on the onset and growth of interface delamination and the film buckling are investigated. |
| Keywords: | Interface delamination Film buckling Traction-separation law |
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