The network structure of silicone release coatings

Silicone release coatings are used by the pressure-sensitive adhesive industry for labeling applications. A background discussion of silicone release coatings is presented. Methodology for determining the network structure of photolytically cured systems prepared by the cationic ring opening polymerization of an epoxy silicone fluid is described. Under typical polymerization conditions, these networks contain no unreached epoxides and have very low degrees of polymerization (D_p), indicating that termination is competitive with propagation. A method has also been developed to determine the network structure of thermally cured systems prepared by the platinum-catalyzed hydrosilylation of silicone vinyl compounds with silicone hydrides. The nature of the cross-links and the types of residual functionality have been determined and the systems have been shown to undergo a postcure.This paper was presented at the Second International Topical Workshop, Advances in Silicon-Based Polymer Science.