Wetting interaction between Sn-Zn-Ag solders and Cu |
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| Authors: | Kwang-Lung Lin Chia-Ling Shih |
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| Affiliation: | (1) Department of Materials Science and Engineering, National Cheng Kung University, Tainan, Taiwan |
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| Abstract: | The wetting interaction of Sn-(7.1–9)Zn-(0–3)Ag solders with Cu was investigated from 230°C to 300°C. The wetting time, wetting forces, and activation energy of the wetting reaction were studied. The wetting time decreases with increasing temperature and increases with Ag content. The wetting force exhibits a disproportional correlation to temperature rise, while no trend was observed with respect to Ag content. The wetting behavior was ascribed to the interaction between Cu and Zn. The AgZn3 compound was formed at the interface when the solder contains 0.3% Ag and above, while it was formed within the bulk solder at 2% Ag and above. |
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| Keywords: | Pb-free solder wetting intermetallic compound Sn-Zn-Ag |
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