Finite element investigation of backbone binder removal from MIM copper compact

Abstract

Finite element (FE) model based on kinetic analysis was developed to describe the thermal debinding process of previously solvent debinded metal injection moulded (MIM) copper compacts. Thermophysical properties (specific heat, density, thermal diffusivity and thermal conductivity as a function of temperature) of MIM copper compact were measured using differential scanning calorimeter, laser flash analyser, thermogravimetry analyser and pushrod dilatometer. The proposed model is solved numerically to study binder removal and binder distribution during thermal debinding. The investigations included the analysis of residual (backbone) binder content for cylindrical MIM copper compacts at different temperatures and positions. The FE calculations are strongly based on measured thermophysical data and kinetic analysis of copper system. The FE simulated and experimental results were compared to validate the underlying FE model based on FE temperature field calculations. Drawing the real furnace temperature conditions in finite calculation can result in obtaining more accurate data.