基于PCB的次磷酸钠化学镀铜研究

为解决传统甲醛化学镀铜体系环境污染及稳定性低的问题,以次磷酸钠化学镀铜体系为研究对象,采用SEM、XRD、电化学等测试方法,探讨了添加剂硫酸镍、α-α’联吡啶和马来酸对该体系的影响.结果表明:适量的硫酸镍和马来酸均能提高化学镀速并改善镀层外观质量,其适宜的质量浓度分别为0.8 g/L和10 mg/L;α–α’联吡啶能明显改善镀层外观质量,其适宜的质量浓度为10 mg/L;次磷酸钠体系的镀液稳定性能优越,加入混合添加剂在80℃下稳定时间近48 h;混合添加剂使化学镀铜阴极峰电流增大;在最佳工艺条件下镀速为5.10μm/h,获得的镀层均匀、致密,施镀20 min后背光级数达到10级.

Electroless copper plating on PCB using sodium hypophosphite as reducing agent

The influences of additives(nickel sulfate,L–arginine,α–α’–dipyridyl and maleic acid)on sodium hypophosphite electroless copper plating were investigated using SEM,XRD and electrochemical tests to solve the problem of pollution and low stability of formaldehyde electroless copper plating.The results show that the plating rate and coating quality are increased by proper amount of nickel sulfate and maleic acid,and the appropriate dosage are 0.8 g·L-1 and 10 mg·L-1,respectively,the coating quality is greatly improved by proper amount of α–α’–dipyridyl and the proper amount is 10 mg·L-1.The stability of sodium hypophosphite bath is excellent,and the stability time of bath with the addition of mixed additives reaches the highest of 48 h at 80 ℃.The cathode peak current density is also increased after mixed additives are added.The plating rate is 5.10 μm·h-1 and the coating is uniform and compact under optimal conditions,the backlight level achieves 10 grade after plating for 20 min.