| PCB孔铜断裂失效分析探讨 |
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| 引用本文： | 刘顺华,刘兴龙,王君兆.PCB孔铜断裂失效分析探讨[J].印制电路信息,2021(2). |
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| 作者姓名： | 刘顺华 刘兴龙 王君兆 |
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| 作者单位： | 中车青岛四方车辆研究所有限公司;深圳市美信咨询有限公司;深圳市美信检测技术股份有限公司 |
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| 摘 要： | 针对PCB在SMT后出现的通孔开路问题,本文结合孔铜断裂失效案例,通过CT、金相切片、SEM及热分析等分析手段来进行论证,分析PCB孔铜断裂的失效机理,并给出了预防控制建议。
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| 关 键 词： | 印制电路板 孔金属化 孔铜断裂 金相组织 失效分析 |
Discussion on fracture analysis of PCB plated through hole |
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| Liu Shunhua,Liu Xinglong,Wang Junzhao.Discussion on fracture analysis of PCB plated through hole[J].Printed Circuit Information,2021(2). |
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| Authors: | Liu Shunhua Liu Xinglong Wang Junzhao |
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| Affiliation: | (CRRC Qingdao Sifang Rolling Stock Research Institute Co.,Ltd.Qingdao 266000,China;Meixin Consulting Co.,Ltd.Shenzhen 518034,China;Meixin Testing Technology Co.,Ltd.Shenzhen 518034,China) |
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| Abstract: | For the open circuit failure of PCB plated though hole(PTH)after SMT,the article analyzed the failure mechanism of PTH,which combines actual failure cases.Using the analytical methods of CT/Metallurgical structure/SEM/thermal performance test,the causes of the PTH failure was analyzed,and the prevention measure was put forward. |
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| Keywords: | Printed Circuit Board Plated Through Hole The Fracture of PTH Metallurgical Structure Failure Analysis |
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