| HgCdTe焦平面探测器热应力有限元分析 |
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| 引用本文： | 吴永红,武文.HgCdTe焦平面探测器热应力有限元分析[J].计算机辅助工程,2011,20(1):113-116. |
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| 作者姓名： | 吴永红 武文 |
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| 作者单位： | 中国科学院上海技术物理研究所,上海,200083 |
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| 摘 要： | 为降低HgCdTe焦平面探测器的内热应力、提高其可靠性,在MSC Patran和MSC Nastran 中对HgCdTe焦平面探测器进行热-力耦合分析.借助MSC Patran的参数化建模方法建立焦平面探测器的有限元模型,对该模型进行热分析,将结果作为温度载荷进行静力分析,得出HgCdTe芯片热应力分布情况.通过分析5...
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| 关 键 词： | HgCdTe焦平面探测器 热应力 热力耦合 有限元 MSC Patran MSC Nastran PCL |
| 收稿时间： | 2010/10/22 0:00:00 |
| 修稿时间： | 2010/12/22 0:00:00 |
Finite element analysis on thermal stress of HgCdTe focal plane detector |
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| WuYonghong and Wu Wen.Finite element analysis on thermal stress of HgCdTe focal plane detector[J].Computer Aided Engineering,2011,20(1):113-116. |
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| Authors: | WuYonghong and Wu Wen |
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| Affiliation: | (Shanghai Institute of Technical Physics,Chinese Academy of Sciences,Shanghai 200083,China) |
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| Abstract: | To decrease the internal thermal stress and improve reliability of HgCdTe focal plane detector,its thermal-mechanical coupling is analyzed in MSC Patran and MSC Nastran.The finite element model is established by using parametrization modeling method of MSC Patran and then the thermal analysis is performed on the model.The analysis result is taken as temperature load of static analysis to obtain the thermal stress distribution of HgCdTe chips.The design optimization scheme for focal plane detector is obtained by analyzing five kinds of cushion material and six kinds of substrates with different thickness.The products made by this method have been delivered for production and engineering application. |
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| Keywords: | HgCdTe focal plane detector thermal stress thermal-mechanical coupling finite element MSC Patran MSC Nastran PCL |
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