| 钨粉化学镀铜对压制性能的影响 |
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| 引用本文： | 刘永旺,姜国圣,王志法,吴泓.钨粉化学镀铜对压制性能的影响[J].电子科技,2013,26(7):154-156. |
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| 作者姓名： | 刘永旺 姜国圣 王志法 吴泓 |
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| 作者单位： | (1.中国电子科技集团公司第13研究所 物资处,河北 石家庄 050051;2.中南大学 材料科学与工程学院,湖南 长沙 410012) |
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| 摘 要： | 通过钨粉表面化学镀铜,使其表面包覆一层均匀的诱导铜膜,以此制备W-15Cu电子封装材料。采用扫描电镜和双对数压制方程理论分析,研究钨粉表面化学镀铜含量对钨粉压制性能的影响,结果表明钨粉表面化学镀铜可改善其压制性能,且随化学镀铜含量的增加,压制同等生坯密度的制品压力增大。
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| 关 键 词： | 化学镀铜 钨粉 压制性能 |
The Effects of W-85Cu Heat Sinks on Pressing Properties |
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| LIU Yongwang
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JIANG Guosheng
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WANG Zhifa
,
WU Hong.The Effects of W-85Cu Heat Sinks on Pressing Properties[J].Electronic Science and Technology,2013,26(7):154-156. |
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| Authors: | LIU Yongwang JIANG Guosheng WANG Zhifa WU Hong |
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| Affiliation: | (1.DMS,13; Research Institute,CETC,Shijiazhuang 050051,China;2.School of Material Science and Engineering,Central South University,Changsha 410083,China) |
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| Abstract: | W-85Cu heat sinks are prepared by using electroless plating copper film on the surface of tungsten powder.The effects of the content of the electroless plating copper film on the properties of pressing properties are researched.The results show that the electroless copper film can improve the pressing properties of tungsten powder and the pressing pressure of the same density samples increases with the content of electroless plating copper. |
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| Keywords: | electroless plating copper tungsten powder pressing properties |
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