深孔镀锡抗蚀不良解决方案

随着背板的出现,板件厚度越来越高,同时板件的布线密度也越来越大,迫切需要采用精细线路和小孔来应对这种发展趋势。在这种情况下,高厚径比板件将逐渐成为PCB发展的主流。但这将对加工制程提出巨大的挑战,特别是镀锡抗蚀层的退膜蚀刻流程。文章主要针对高AR值（≥8∶1）板件图形电镀制作过程中出现的抗蚀不良孔无铜进行分析和研究,达到提升生产线加工能力和板件品质的目的。

Solution for Tin EtchResist Faults of High Aspect Ratio Plating

With the emergence of backplane, the board thickness become thicker and thicker. In the meantime, routing density also become higher and higher, line line and small hole diameter are our choice to cater for this trend. In this case ,high aspect ratio PCBs will gradually dominate in the future. There will be a great challenge, especially for tin etchresist plating in pattern plating process. This article focuses on the root cause of plating hole void in pattern plating process, to promote the development of the process capabilities and the quality of PCBs.