The stability of LaNi5 in a Cu matrix

The reaction of LaNi₅ with Cu powder during sintering at high temperature was examined in order to obtain better conductivity and ductility. Pressurized and forged copper-LaNi₅ pellets were investigated by optical metallography, DTA, XRD and TEM. The need for heat treatment after pressing and/or forging is vital to obtain good diffusion bonding between the copper particles and to improve the material strength. No interaction between La, Ni and Cu were observed after heating at 1173 K but a very stable La₂O₃ phase was created around the LaNi₅ particle. Rolling up to 85% reduction showed good ductility.