微通道散热单元散热特性数值优化分析

文中为提升T/R组件散热能力,建立了组件内置微通道散热单元数值模型,对传热特性相关参数进行了数值仿真分析。 研究了微通道宽度、侧壁垂直度、流经长度等对芯片结温、压力损失的影响;对比了冷却介质初始流量、初始温度对散热特性的影响,并对实物样件的散热性能进行了测试对比。 结果表明,微通道宽度、侧壁垂直度、流经长度的参数优化组合可提升散热能力,降低流阻;微通道散热单元压力损失随着冷却介质体积流量的增大呈线性增大。本研究优选出最佳参数组合,为实物样件制造提供了设计依据,促进了微通道冷却技术工程化应用进程。

Numerical Simulation on Thermal Properties of Micro-channel Heat Dissipation Unit

In order to enhance the heat dissipation capacity of T/R module, a module built-in micro-channel numerical model is built and the analysis of relevant parameters of heat transfer is carried out. The effects of the structural characteristics of micro-channel such as channel width, length and side-wall verticality on chip junction temperature and pressure loss are studied. The influences of the initial flow rate and temperature of cooling medium on the thermal properties are compared. The heat transfer performances of prototypes are compared by test. The numerical simulation results show that the parameter combination optimization of channel width, length and side-wall verticality can improve the heat dissipation and reduce the flow resistance; that the pressure loss of the micro-channel heat dissipation unit increases linearly with the increase of the flow rate of cooling medium. The optimal combination of parameters is selected to provide guidance for prototype manufacturing, which promotes the engineering application of micro-channel cooling technology.