| 嵌入式电子加成制造技术 |
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| 引用本文： | 罗头平,王波,安兵,吴懿平. 嵌入式电子加成制造技术[J]. 电子工艺技术, 2010, 31(2): 77-80,89 |
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| 作者姓名： | 罗头平 王波 安兵 吴懿平 |
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| 作者单位： | 武汉光电国家实验室微纳制造部,湖北,武汉,430074;华中科技大学,湖北,武汉,430074;武汉光电国家实验室微纳制造部,湖北,武汉,430074;华中科技大学,湖北,武汉,430074;武汉光电国家实验室微纳制造部,湖北,武汉,430074;华中科技大学,湖北,武汉,430074;武汉光电国家实验室微纳制造部,湖北,武汉,430074;华中科技大学,湖北,武汉,430074 |
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| 基金项目： | 国家自然科学基金项目(项目编号:60876070) |
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| 摘 要： | 简述了目前电子制造领域中的四种嵌入式加成制造技术—CIP(Chip in Polymer)技术、CL(Chip Last)技术、奥克姆(Occam)技术及IMB(Chip in Board)技术,及其主要的工艺流程。这四种加成制造技术都不使用焊料,无高温回流工艺,可实现高可靠性、高性能和高密度的三维封装制造,同时也属于绿色制造技术,所以具有广阔的发展前景。
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| 关 键 词： | 嵌入式 电子制造 加成技术 封装 |
Review of Embedded Electronic Additive Manufacture Technology |
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| LUO Tou-ping,WANG Bo,AN Bing,WU Yi-ping. Review of Embedded Electronic Additive Manufacture Technology[J]. Electronics Process Technology, 2010, 31(2): 77-80,89 |
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| Authors: | LUO Tou-ping WANG Bo AN Bing WU Yi-ping |
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| Affiliation: | 1.Division of Micro-Nano Manufacture;Wuhan National Laboratory for Optoelectronics;Wuhan 430074;China;2.Huazhong University of Science & Technology;China |
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| Abstract: | Four embedded additive manufacture technologies-CIP,Chip last,Occam and IMB in electronic manufacture field as well as theirs process flows are introduced.To conclude,the process methods of the four additive manufacture technologies are different and they have advantages and disadvantages of their own.The important is that non solder and reflow process are needed in the four technologies,but can meet the need of high quality,advanced performance and high density.Also,all of the four technology are environme... |
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| Keywords: | Embedding Electronic manufacture Additive technology Electronic packaging |
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