磁控溅射法制备电磁屏蔽织物的研究

本文采用直流磁控溅射在无纺布基底上溅射沉积金属铜来制备电磁屏蔽织物。通过原子力显微镜观察发现,工艺参数对溅射沉积速率以及膜层的表面形貌都有较大的影响。在一定范围内,溅射功率越大,沉积速率越大,膜层颗粒分布越均匀致密。溅射压力一般选取0.9 Pa左右为宜,在此压力下,溅射沉积速率最大。经测试膜层与基底结合牢度较好,溅射沉积铜后透气性变化较小。频谱分析仪测试结果表明织物的屏蔽性能十分优良。

Electromagnetic Shielding Fabrics with Magnetron Sputtered Copper Coating

Copper films were coated on non-woven fabrics by dc magnetron sputtering to fabricate electromagnetic shielding.The films were characterized with scanning electron microscopy(SEM) and atomic force microscopy(AFM).The results show that the sputtering conditions significantly affect its deposition rate and its surface morphology.In the specified range,as sputtering power increasess,the deposition rate increases and the film becomes increasingly compact with uniformly distributed copper grains.At a sputtering pressure of 0.9 Pa,maximum deposition rate can be obtained.Moreover,the adhesion at the interface of copper films and fabrics is found to be fairly strong,and the coating almost little affects the gas permeability.Our spectroscopic study shows that the fabrics display excellent electromagnetic shielding.